Complexity: This board features a high-density SoC/FPGA BGA design, surrounded by 0201 passive components, requiring extreme precision in SMT placement.
Interconnect Technology: Utilizes advanced HDI (High-Density Interconnect) with blind and buried vias to manage complex signal routing in a compact form factor.
Interface Rich: Integrated with multiple FPC/FFC connectors (J10-J26), SIM/MicroSD slots, and high-speed display interfaces.
| Feature |
QHPCBA (Factory‑Direct) |
Generic Platforms |
| Response Time |
Direct Engineering Review |
12‑24h Customer Support Ticket |
| Production Speed |
8 Hours (SMT) |
3‑7 Days (Standard) |
| Middleman Markup |
0% (Factory Pricing) |
Platform Commission Fees |
| DFM Feedback |
Active & Collaborative |
Automated "Reject" |
| Facility Access |
Visit Our Shenzhen Factory |
Virtual/Office Address |
Manufacturing Excellence at QHPCBA
Our factory specializes in the rapid prototyping of complex HDI boards, ensuring structural integrity and signal fidelity.
Ultra-Precision Stencil (2-Hour): Custom laser-cut stencils with nano-coating options for perfect BGA solder release.
Rapid PCB Fabrication (24-48H): Specialized supply chain for multi-layer HDI prototyping.
Expert SMT Assembly (8-Hour): Equipped with high-speed Yamaha/Pana-sonic mounters capable of 01005 component placement and X-Ray BGA inspection.
Quality Control
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X-Ray Inspection: 100% inspection for BGA & QFN internal soldering.
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AOI Testing: Full automated optical inspection for all SMT components.
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Impedance Control: Strict tolerance matching for high-speed differential pairs.
